Semiconductor package having semiconductor constructing body...

Details Semiconductor package having semiconductor constructing body... Semiconductor package having semiconductor constructing body...

2006-02-22

2009-06-30

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S106000, C438S107000, C438S109000, C438S113000, C438S118000, C257SE21505

Reexamination Certificate

active

07553698

ABSTRACT:
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating film covers the semiconductor constructing body. Each of interconnections which has a projecting electrode is formed on the insulating film. The projecting electrodes of the interconnection cut through the insulating film at portions corresponding to the external connection electrodes and electrically connected to the external connection electrodes.

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