Semiconductor package having recessed die cavity walls

Details Semiconductor package having recessed die cavity walls Semiconductor package having recessed die cavity walls

1989-03-28

1990-05-15

Hille, Rolf

357 68, H01L 2312, H01L 2304

Patent

active

049262408

ABSTRACT:
A semiconductor package having recessed die cavity walls to prevent rejectable packages due to excess die attach material overflow. A recessed area is disposed beneath a wire bond shelf and serves as an area into which excess die attach material may flow so that it does not impede wire bonding by flowing onto the bond posts disposed on the wire bond shelf or the bond pads disposed on the top of a semiconductor die.

Affiliated with

Also associated with

Rating

Semiconductor package having recessed die cavity walls does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package having recessed die cavity walls, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package having recessed die cavity walls will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-625253