Semiconductor package having passive component disposed...

Details Semiconductor package having passive component disposed... Semiconductor package having passive component disposed...

2007-01-23

2007-01-23

Soward, Ida M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S678000, C257S680000, C257S684000, C257S685000, C257S686000, C257S730000

Reexamination Certificate

active

11028757

ABSTRACT:
A semiconductor package includes a semiconductor device and a passive component mounted and electrically coupled to a substrate. The passive component is disposed within a cavity portion formed on an upper surface of the substrate and the semiconductor device is disposed across the cavity portion of the substrate above the passive component.

REFERENCES:
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patent: 6445591 (2002-09-01), Kwong
patent: 6781222 (2004-08-01), Wu et al.
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patent: 6998721 (2006-02-01), Zhou
patent: 2001/0010398 (2001-08-01), Farooq et al.
patent: 2002/0117748 (2002-08-01), Avery et al.
patent: 2004/0022038 (2004-02-01), Figueroa et al.
patent: 2004/0150082 (2004-08-01), Kajiwara et al.
patent: 2005/0156310 (2005-07-01), Benner et al.
patent: 2006/0081980 (2006-04-01), Fernandez

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