Semiconductor package having multi-signal bus bars

Details Semiconductor package having multi-signal bus bars Semiconductor package having multi-signal bus bars

2006-04-25

2006-04-25

Owens, Douglas W (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S698000, C257S713000

Reexamination Certificate

active

07034390

ABSTRACT:
A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.

REFERENCES:
patent: 3812402 (1974-05-01), Garth
patent: 4381423 (1983-04-01), Taylor
patent: 4654472 (1987-03-01), Goldfarb
patent: 4976624 (1990-12-01), Ishizuka et al.
patent: 6097086 (2000-08-01), Crane, Jr. et al.
patent: 6388207 (2002-05-01), Figueroa et al.
patent: 6724077 (2004-04-01), Gates et al.
patent: WO 02/069397 (2002-09-01), None
Patent Abstract of Japan, vol. 199, No. 08, Jun. 30, 1999, & JP 11 067985 (Hiroshima Nippon Denki KK), Mar. 9, 1999.

Affiliated with

Also associated with

Rating

Semiconductor package having multi-signal bus bars does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package having multi-signal bus bars, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package having multi-signal bus bars will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3582900