Semiconductor package having mechanically and electrically bonde

Details Semiconductor package having mechanically and electrically bonde Semiconductor package having mechanically and electrically bonde

1997-10-20

1999-09-28

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257772, H01L 2348

Patent

active

059593555

ABSTRACT:
A semiconductor package having an array of solder pads and supportive elements that are mechanically and electrically bonded to the solder pads and that do not collapse during the bonding process, wherein the supportive elements are annular.

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English Language European Search Report dated Mar. 27, 1997 (3 pages).
European Search Report from European patent application No. 96410112, filed Oct. 30, 1996.
Patent Abstract of Japan, vol. 008, No. 155, Jul. 19, 1984 and JP 59058843, invented by Inoue Yukihiro, publication date Apr. 4, 1984.

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