Semiconductor package having light, thin, simple and compact str

Details Semiconductor package having light, thin, simple and compact str Semiconductor package having light, thin, simple and compact str

1997-10-02

1999-11-16

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257692, 257696, H01L 23495, H01L 2348

Patent

active

059863340

ABSTRACT:
A semiconductor package having a light, thin, simple and compact structure including outer leads having a minimum length and a resin encapsulate having a minimum volume. The semiconductor package includes a package body, a semiconductor chip mounted on a central portion of the body, inner and outer leads bonded to a peripheral portion of an upper surface of the body by an insulating layer in such a manner that the leads are supported on the body, conductive wires or bumps for electrically connecting the inner leads to the semiconductor chip, a resin encapsulate for encapsulating the semiconductor chip, the conductive wires or bumps and the inner leads. Each outer lead has an end positioned at a level higher than an upper surface of the semiconductor chip so that a boundary portion defined between the associated outer and inner leads serves as a barrier for the resin encapsulate. The end of each outer lead is exposed outside the resin encapsulate and extending to a peripheral edge of the body.

REFERENCES:
patent: 4534105 (1985-08-01), Reusch
patent: 5198886 (1993-03-01), Verspeek et al.
patent: 5331203 (1994-07-01), Wojnarowski et al.
patent: 5583370 (1996-12-01), Higgins, III et al.
patent: 5684330 (1997-11-01), Lee
patent: 5821615 (1998-10-01), Lee

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