Semiconductor package having light sensitive chips

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S098000, C257S433000, C257S787000

Reexamination Certificate

active

07095054

ABSTRACT:
A microelectronic package includes a light sensitive microelectronic element having a front face including one or more contacts and a rear surface, and conductive leads having first ends connected to the one or more contacts and second ends connected to one or more conductive pads adjacent the light sensitive microelectronic element. The package also includes an at least partially transparent encapsulant covering the light sensitive microelectronic element, the conductive leads and the one or more conductive pads, whereby the one or more conductive pads are exposed on a surface of the encapsulant.

REFERENCES:
patent: 3764862 (1973-10-01), Jankowski
patent: 4040078 (1977-08-01), Ecton, Jr. et al.
patent: 4530152 (1985-07-01), Roche et al.
patent: 4566184 (1986-01-01), Higgins et al.
patent: 4890383 (1990-01-01), Lumbard et al.
patent: 5079190 (1992-01-01), Mihara
patent: 5122860 (1992-06-01), Kikuchi et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5298768 (1994-03-01), Okazaki et al.
patent: 5355016 (1994-10-01), Swirbel et al.
patent: 5367766 (1994-11-01), Burns et al.
patent: 5418186 (1995-05-01), Park et al.
patent: 5436203 (1995-07-01), Lin
patent: 5468999 (1995-11-01), Lin et al.
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5487999 (1996-01-01), Farnworth
patent: 5557150 (1996-09-01), Variot et al.
patent: 5851847 (1998-12-01), Yamanaka
patent: 5900676 (1999-05-01), Kweon et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6060729 (2000-05-01), Suzuki et al.
patent: 6531328 (2003-03-01), Chen
patent: 6583444 (2003-06-01), Fjelstad
patent: 6888168 (2005-05-01), Fjelstad
patent: 751561 (1997-01-01), None
patent: 54-71986 (1979-08-01), None
patent: 63-283136 (1988-11-01), None
patent: 1-270282 (1989-10-01), None
patent: 03-94430 (1991-04-01), None
patent: 03-94431 (1991-04-01), None
patent: 03094459 (1991-04-01), None
patent: 04137570 (1992-05-01), None
patent: 7-15046 (1995-01-01), None
patent: 07064208 (1995-03-01), None
patent: 8-241974 (1996-09-01), None

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