Semiconductor package having light sensitive chips

Details Semiconductor package having light sensitive chips Semiconductor package having light sensitive chips

2005-05-03

2005-05-03

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

In combination with or also constituting light responsive...

C257S082000, C257S088000, C257S100000, C257S724000, C257S787000

Reexamination Certificate

active

06888168

ABSTRACT:
A microelectronic package including an optoelectronic element having a front face including contacts and a rear surface; flexible conductive leads having first ends connected to the contacts and second ends connected to conductive pads adjacent the optoelectronic element; and an at least partially transparent encapsulant covering the optoelectronic element, the flexible leads and the conductive pads, the conductive pads being exposed on a bottom surface of the encapsulant, the bottom surface of the encapsulant defining a bottom of the package, wherein the encapsulant at the bottom of the package extends between the conductive pads.

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