Semiconductor package having improved adhesiveness and...

Details Semiconductor package having improved adhesiveness and... Semiconductor package having improved adhesiveness and...

2006-06-27

2006-06-27

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257SE23001, C257SE23031, C257SE23050, C257SE23061, C257S696000, C257S698000, C257S796000, C257S666000, C257S712000, C257S713000, C257S717000, C257S707000, C257S711000, C257S786000, C257S784000

Reexamination Certificate

active

07067908

ABSTRACT:
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality of tabs are formed in the chip paddle may also be used alone or in conjunction with the through-holes to further increase the bonding strength of the encapsulation material in the package body. The tabs provide additional area for the bonding site to ground wires from the semiconductor chip by increasing the length of the chip paddle.

REFERENCES:
patent: 2596993 (1952-05-01), Gookin
patent: 3435815 (1969-04-01), Forcier
patent: 3734660 (1973-05-01), Davies et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 4054238 (1977-10-01), Lloyd et al.
patent: 4189342 (1980-02-01), Kock
patent: 4258381 (1981-03-01), Inaba
patent: 4289922 (1981-09-01), Devlin
patent: 4301464 (1981-11-01), Otsuki et al.
patent: 4332537 (1982-06-01), Slepcevic
patent: 4417266 (1983-11-01), Grabbe
patent: 4451224 (1984-05-01), Harding
patent: 4530152 (1985-07-01), Roche et al.
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 4646710 (1987-03-01), Schmid et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4727633 (1988-03-01), Herrick
patent: 4737839 (1988-04-01), Burt
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4812896 (1989-03-01), Rothgery et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4907067 (1990-03-01), Derryberry
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 4942454 (1990-07-01), Mori et al.
patent: 4987475 (1991-01-01), Schlesinger et al.
patent: 5018003 (1991-05-01), Yasunaga
patent: 5029386 (1991-07-01), Chao et al.
patent: 5041902 (1991-08-01), McShane
patent: 5057900 (1991-10-01), Yamazaki
patent: 5059379 (1991-10-01), Tsutsumi et al.
patent: 5065223 (1991-11-01), Matsuki et al.
patent: 5070039 (1991-12-01), Johnson et al.
patent: 5087961 (1992-02-01), Long et al.
patent: 5091341 (1992-02-01), Asada et al.
patent: 5096852 (1992-03-01), Hobson
patent: 5118298 (1992-06-01), Murphy
patent: 5122860 (1992-06-01), Kikuchi et al.
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5151039 (1992-09-01), Murphy
patent: 5157475 (1992-10-01), Yamaguchi
patent: 5157480 (1992-10-01), McShane et al.
patent: 5168368 (1992-12-01), Gow, III et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5172214 (1992-12-01), Casto
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5214845 (1993-06-01), King et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5218231 (1993-06-01), Kudo
patent: 5221642 (1993-06-01), Burns
patent: 5250841 (1993-10-01), Sloan et al.
patent: 5252853 (1993-10-01), Michii
patent: 5258094 (1993-11-01), Furui et al.
patent: 5266834 (1993-11-01), Nishi et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5277972 (1994-01-01), Sakumoto et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5279029 (1994-01-01), Burns
patent: 5281849 (1994-01-01), Singh Deo et al.
patent: 5294897 (1994-03-01), Notani et al.
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5332864 (1994-07-01), Liang et al.
patent: 5335771 (1994-08-01), Murphy
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5343076 (1994-08-01), Katayama et al.
patent: 5358905 (1994-10-01), Chiu
patent: 5365106 (1994-11-01), Watanabe
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5391439 (1995-02-01), Tomita et al.
patent: 5406124 (1995-04-01), Morita et al.
patent: 5410180 (1995-04-01), Fujii et al.
patent: 5414299 (1995-05-01), Wang et al.
patent: 5417905 (1995-05-01), Lemaire et al.
patent: 5424576 (1995-06-01), Djennas et al.
patent: 5428248 (1995-06-01), Cha
patent: 5435057 (1995-07-01), Bindra et al.
patent: 5444301 (1995-08-01), Song et al.
patent: 5452511 (1995-09-01), Chang
patent: 5454905 (1995-10-01), Fogelson
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5484274 (1996-01-01), Neu
patent: 5493151 (1996-02-01), Asada et al.
patent: 5508556 (1996-04-01), Lin
patent: 5517056 (1996-05-01), Bigler et al.
patent: 5521429 (1996-05-01), Aono et al.
patent: 5528076 (1996-06-01), Pavio
patent: 5534467 (1996-07-01), Rostoker
patent: 5539251 (1996-07-01), Iverson et al.
patent: 5543657 (1996-08-01), Diffenderfer et al.
patent: 5544412 (1996-08-01), Romero et al.
patent: 5545923 (1996-08-01), Barber
patent: 5581122 (1996-12-01), Chao et al.
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5592025 (1997-01-01), Clark et al.
patent: 5594274 (1997-01-01), Suetaki
patent: 5595934 (1997-01-01), Kim
patent: 5604376 (1997-02-01), Hamburgen et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5608267 (1997-03-01), Mahulikar et al.
patent: 5625222 (1997-04-01), Yoneda et al.
patent: 5633528 (1997-05-01), Abbott et al.
patent: 5639990 (1997-06-01), Nishihara et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5641997 (1997-06-01), Ohta et al.
patent: 5643433 (1997-07-01), Fukase et al.
patent: 5644169 (1997-07-01), Chun
patent: 5646831 (1997-07-01), Manteghi
patent: 5650663 (1997-07-01), Parthasarathi
patent: 5661088 (1997-08-01), Tessier et al.
patent: 5665996 (1997-09-01), Williams et al.
patent: 5673479 (1997-10-01), Hawthorne
patent: 5683806 (1997-11-01), Sakumoto et al.
patent: 5689135 (1997-11-01), Ball
patent: 5696666 (1997-12-01), Miles et al.
patent: 5701034 (1997-12-01), Marrs
patent: 5703407 (1997-12-01), Hori
patent: 5710064 (1998-01-01), Song et al.
patent: 5723899 (1998-03-01), Shin
patent: 5724233 (1998-03-01), Honda et al.
patent: 5726493 (1998-03-01), Yamashita
patent: 5736432 (1998-04-01), Mackessy
patent: 5745984 (1998-05-01), Cole, Jr. et al.
patent: 5753532 (1998-05-01), Sim
patent: 5753977 (1998-05-01), Kusaka et al.
patent: 5766972 (1998-06-01), Takahashi et al.
patent: 5770888 (1998-06-01), Song et al.
patent: 5776798 (1998-07-01), Quan et al.
patent: 5783861 (1998-07-01), Son
patent: 5801440 (1998-09-01), Chu et al.
patent: 5814877 (1998-09-01), Diffenderfer et al.
patent: 5814881 (1998-09-01), Alagaratnam et al.
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5814884 (1998-09-01), Davis et al.
patent: 5817540 (1998-10-01), Wark
patent: 5818105 (1998-10-01), Kouda
patent: 5821457 (1998-10-01), Mosley et al.
patent: 5821615 (1998-10-01), Lee
patent: 5834830 (1998-11-01), Cho
patent: 5835988 (1998-11-01), Ishii
patent: 5844306 (1998-12-01), Fujita et al.
patent: 5856911 (1999-01-01), Riley
patent: 5859471 (1999-01-01), Kuraishi et al.
patent: 5866939 (1999-02-01), Shin et al.
patent: 5871782 (1999-02-01), Choi
patent: 5874784 (1999-02-01), Aoki et al.
patent: 5877043 (1999-03-01), Alcoe et al.
patent: 5886397 (1999-03-01), Ewer
patent: 5886398 (1999-03-01), Low et al.
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5897339 (1999-04-01), Song et al.
patent: 5900676 (1999-05-01), Kweon et al.
patent: 5903049 (1999-05-01), Mori
patent: 5903050 (1999-05-01), Thurairajaratnam et al.
patent: 5909053 (1999-06-01), Fukase et al.
patent: 5915998 (1999-06-01), Stidham et al.
patent: 5917242 (1999-06-01), Ball
patent: 5939779 (1999-08-01), Kim
patent: 5942794 (1999-08-01), Okumura et al.
patent: 5951305 (1999-09-01), Haba
patent: 5959356 (1999-09-01), Oh
patent: 5969426 (1999-10-01), Baba et al.
patent: 5973388 (1999-10-01), Chew et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 5977613 (1999-11-01), Takata et al.
patent: 5977615 (1999-11-01), Yamaguchi et al.
patent: 5977630 (1999-11-01), Woodworth et al.
patent: 5981314 (1999-11-01), Glenn et al.
patent: 5986333 (1999-11-01), Nakamura
patent: 5986885 (1999-11-01), Wyland
patent: 6001671 (1999-12-01), Fjelstad
patent: 6013947 (2000-01-01), Lim
patent: 6018189 (2000-01-01), Mizuno
patent: 6020625 (2000-02-01), Qin et al.
patent: 6025640 (2000-02-01), Yagi et al.
patent: 6031279 (2000-02-01), Lenz
patent: RE36613 (2000-03-01), Ball
patent: 6034423 (2000-03-01), Mostafazadeh et al.
patent: 6040626 (2000-03-01), Cheah et al.
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