Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2006-12-19
2006-12-19
Parker, Kenneth (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S122000, C438S124000, C257S666000, C257S787000, C257SE25011
Reexamination Certificate
active
07151013
ABSTRACT:
A high density semiconductor package with thermally enhanced properties is described. The semiconductor package includes a pair of lead frames, each being attached to a respective semiconductor die. The dies are attached to respective lead frames via an adhering material, such as a tape. Further, the dies are each electrically connected to fingers of each lead frame. In one illustrated embodiment, the dies and portions of the fingers are encapsulated in such a way as to leave one surface of each die exposed. In another illustrated embodiment, heat dissipation for the semiconductor package occurs through exposed fingers of the lead frames which adhere semiconductor dies within a cavity located therebetween.
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Brooks Mike
Corisis David J.
Johnson Mark S.
Kinsman Larry D.
Diaz José R.
Dickstein & Shapiro LLP
Parker Kenneth
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