Semiconductor package having etched-back silver-copper braze

Details Semiconductor package having etched-back silver-copper braze Semiconductor package having etched-back silver-copper braze

1997-01-13

1999-04-27

Powell, William

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

438694, 438754, 20412935, 20412995, 216 13, B08B 600, B23H 300, H01L 21302

Patent

active

058968695

ABSTRACT:
An electroetching method for removing excess silver-copper braze material from the edges of I/O pads during the manufacture of chip carriers for microelectronic devices, and the product thereby produced, are disclosed. The disclosed method is preferably self-limiting, such that braze material is preferentially removed from all regions of the assembly. The method is particularly useful for producing a desirable sidewall profile, size, and extent of coverage of the I/O pad for the fillet of braze material surrounding the base of pins in a pin grid array device. Agitation control is important for producing the desired uniformity and profile.

REFERENCES:
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patent: 4685210 (1987-08-01), King et al.
patent: 5033666 (1991-07-01), Keusseyan et al.
patent: 5387441 (1995-02-01), Do-Thoi et al.
patent: 5491362 (1996-02-01), Hamzehdoost et al.
patent: 5516416 (1996-05-01), Canaperi et al.
patent: 5567984 (1996-10-01), Zalesinski et al.
R. R. Tummala, et al., "Pinned Packages", Microelectronics Packaging Handbook, New York 1989, pp. 785-842.

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