Semiconductor package having connecting bumps

Details Semiconductor package having connecting bumps Semiconductor package having connecting bumps

2005-12-14

2010-11-23

Fahmy, Wael M (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S737000, C257SE23011, C438S613000

Reexamination Certificate

active

07838982

ABSTRACT:
A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals containing a smaller amount of lead, while at the same time achieving a fine pitch of the terminals. The semiconductor package includes a board (20) including a plurality of insulating resin layers, semiconductor element-mounting terminals (18) formed on the uppermost surface of the board, and external connection terminals (12) formed on the bottom surface thereof. Each external connection terminal (12) is formed as a bump projected downward from the bottom surface of the package, and each bump is filled with the insulating resin (14) while the surface thereof is covered by a metal (16). Wiring (24), (26) including a conductor via (26a) electrically connect the metal of the metal layer16and the semiconductor element-mounting terminals (18).

REFERENCES:
patent: 5831832 (1998-11-01), Gillette et al.
patent: 6041495 (2000-03-01), Yoon et al.
patent: 6121682 (2000-09-01), Kim
patent: 6245490 (2001-06-01), Yoon et al.
patent: 6518664 (2003-02-01), Miyamoto
patent: 6740577 (2004-05-01), Jin et al.
patent: 6861757 (2005-03-01), Shimoto et al.
patent: 2001/0035570 (2001-11-01), Iijima et al.
patent: 2002/0030245 (2002-03-01), Hanaoka et al.
patent: 2002/0100977 (2002-08-01), Kimura
patent: 2003/0160325 (2003-08-01), Yoneda et al.
patent: 2004/0197979 (2004-10-01), Jeong et al.
patent: 2005/0127508 (2005-06-01), Lee et al.
patent: 9-283925 (1997-10-01), None

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