Semiconductor package having capacitive extension spokes and met

Details Semiconductor package having capacitive extension spokes and met Semiconductor package having capacitive extension spokes and met

1998-04-30

1999-05-11

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257691, 257670, 257666, H01L23/52;23/48;23/495

Patent

active

059030500

ABSTRACT:
Disclosed is a pair of conductive rings and method for making the conductive rings for introducing an integral network of capacitive structures around a semiconductor die of a semiconductor package. The pair of conductive rings include a ground rail ring that is defined around a semiconductor die pad that is configured to receive a semiconductor die. The ground rail ring has a first plurality of extension spokes that extend away from the ground rail ring. The pair of conductive rings further includes a power rail ring that is defined around the semiconductor die pad. The power rail ring has a second plurality of extension spokes that extend away from the power rail ring and toward the ground rail ring.

REFERENCES:
patent: 5519576 (1996-05-01), Moore
patent: 5672909 (1997-09-01), Glenn et al.
patent: 5691568 (1997-11-01), Chou et al.

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