Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-04-18
2006-04-18
Baumeister, B. William (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S704000, C257S415000, C257S686000, C257S684000, C257S678000, C438S051000, C438S455000, C438S459000, C438S125000, C438S106000
Reexamination Certificate
active
07030494
ABSTRACT:
A semiconductor package includes a semiconductor structure having a plurality of electrodes for external connection which are provided on a semiconductor substrate, an insulation layer provided on the semiconductor structure, an upper wiring having connection pad portions and provided on the insulation layer such that at least parts of the upper wiring are connected to the electrodes for external connection of the semiconductor structure, a micro electric mechanical system electrically connected to parts of the connection pad portions of the upper wiring, pole electrodes provided so as to be electrically connected to other connection pad portions of the upper wiring, and an upper insulation film covering the vicinities of the pole electrodes and at least the vicinity of the micro electric mechanical system.
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Anya Igwe U.
Baumeister B. William
Casio Computer Co. Ltd.
Frishauf Holtz Goodman & Chick P.C.
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