Semiconductor package having an outwardly arced die cavity

Details Semiconductor package having an outwardly arced die cavity Semiconductor package having an outwardly arced die cavity

1988-12-19

1990-04-17

Hille, Rolf

357 70, 357 72, 357 74, H01L 2302, H01L 2312, H01L 2328, H01L 2348

Patent

active

049185128

ABSTRACT:
A semiconductor package having a unique die cavity configuration wherein each side of the die cavity is arced outward from the center of the die cavity. This configuration is especially well suited for use in laminated multilayer ceramic packages.

REFERENCES:
patent: 3864820 (1975-02-01), Brenan et al.

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