Semiconductor package having an optical device and a method...

Details Semiconductor package having an optical device and a method... Semiconductor package having an optical device and a method...

2007-06-12

2007-06-12

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S459000

Reexamination Certificate

active

11363197

ABSTRACT:
The present invention relates to a semiconductor package having an optical device and a method of making the same. The package comprises a chip, an upper metal redistribution layer, a transparent insulating layer, and a lower metal redistribution layer. The chip has an active surface, a back surface, at least one through hole, an optical device, and at least one upper pad, wherein the optical device is electrically connected to the upper pad, and the through hole is filled with a metal post. An insulating layer is disposed between the wall of the through hole and the metal post. The upper metal redistribution layer is disposed on the active surface of the chip, and is used for connecting the upper pad and the metal post. The transparent insulating layer is disposed on the active surface of the wafer. The lower metal redistribution layer is disposed on the back surface of the chip, and is connected to the metal post. Whereby, the optical device is packaged, and the manufacturing process is simplified, and the cost is reduced.

REFERENCES:
patent: 6040235 (2000-03-01), Badehi
patent: 6271469 (2001-08-01), Ma et al.
patent: 6624003 (2003-09-01), Rice
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patent: 6809008 (2004-10-01), Holm et al.
patent: 6891242 (2005-05-01), Gidon et al.
patent: 2004/0057649 (2004-03-01), Towle
patent: 2004/0229405 (2004-11-01), Prabhu

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