Semiconductor package having an interfacial adhesive layer

Details Semiconductor package having an interfacial adhesive layer Semiconductor package having an interfacial adhesive layer

2006-09-13

2008-11-04

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S118000, C438S127000, C438S464000, C257SE21499, C257SE21503

Reexamination Certificate

active

07445963

ABSTRACT:
A semiconductor package has a substrate (8) and a semiconductor die (2). The substrate (8) includes a plurality of contact pads (9) on its upper surface and a second plurality of external contact areas (10) on its bottom surface. The semiconductor die (2) includes an active surface with a plurality of die contact pads (3) electrically connected by conducting means (4) to contact pads (9) on the substrate (8) and a layer of first adhesive means (5) on the upper surface (18) of the die (2). Mold material (15) covers the first adhesive means (5), the die (2) and the upper surface of the substrate (8).

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International Search Report with Written Opinion, PCT/IB2004/000990, 11 pages.

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