Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-06-13
2006-06-13
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257S788000
Reexamination Certificate
active
07060530
ABSTRACT:
A semiconductor package has a base member made of a wiring board or a lead frame, a wall member fixed onto the base member to define a cavity, and a cured-resin cap member for encapsulating a semiconductor chip in the cavity. The curable-resin cap member is fixed onto the wall member by the curing process for the curable-resin cap member.
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patent: 6011303 (2000-01-01), Tanaka et al.
patent: 6313525 (2001-11-01), Sasano
patent: 6432737 (2002-08-01), Webster
patent: 6518501 (2003-02-01), Kawahara et al.
patent: 2001/0045643 (2001-11-01), Katoh et al.
patent: 2000-286354 (2000-10-01), None
Baumeister B. William
Farahani Dana
McGinn IP Law Group PLLC
NEC Compound Semiconductor Devices Ltd.
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