Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2011-07-19
2011-07-19
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S692000, C257S737000, C257S738000, C257S780000, C257S786000
Reexamination Certificate
active
07982316
ABSTRACT:
A semiconductor package and method of fabricating has a substrate having conductive patterns formed thereon. A semiconductor die is attached to the substrate. An electrically connecting member is electrically coupled to the semiconductor die and the conductive patterns. A plurality of lands is coupled to the substrate. At least one land is pivotally mounted to the substrate. A first section of the pivotally mounted land is in contact with the substrate. A second section of the pivotally mounted land is floating to form a void area between the substrate and the second section. An encapsulant is used for encapsulating a top surface of the substrate, the semiconductor die, and the electrically connecting member. A solder ball is electrically coupled to each land.
REFERENCES:
patent: 5166774 (1992-11-01), Banerji
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5801449 (1998-09-01), Dehaine et al.
patent: 6406938 (2002-06-01), Rodenbeck et al.
patent: 6461892 (2002-10-01), Beroz
patent: 6664621 (2003-12-01), Smith et al.
patent: 6965158 (2005-11-01), Smith et al.
patent: 2004/0035519 (2004-02-01), Beroz et al.
patent: 2005/0173805 (2005-08-01), Damberg et al.
Cha Se Woong
Lee Min Woo
Shin Jae Hyun
Amkor Technology Inc.
Andújar Leonardo
Arroyo Teresa M
Weiss & Moy P.C.
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