Semiconductor package having a grid array of pin-attached balls

Details Semiconductor package having a grid array of pin-attached balls Semiconductor package having a grid array of pin-attached balls

2004-08-02

2008-12-09

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07462783

ABSTRACT:
Semiconductor chip (1101) of a ball grid array device (1100) is mounted onto tape substrate (1102) using attach adhesive (1103). The metal layer on the top surface of substrate (1102) uses between about 30% to 90% of its area for connecting lines (1104), and only the remainder for members/rings (1105) and terminals (1106). Routing of differential pair signals and large numbers of signals on a single layer tape package are feasible. This embodiment creates an inexpensive high performance tape ball grid array package for chip-scale devices. Terminals (1106) serve the connection (by bonding wires or reflow bumps) to the chip contact pads. Inserted in members/rings (1105) are the conductive pins (1107), which serve as anchors for the solder bodies/balls (1108). Pins (1107) are substantially insensitive to the thermomechanical stresses, which occur in device (1100) during assembly, testing and operation.

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