Semiconductor package having a bridge plate connection

Details Semiconductor package having a bridge plate connection Semiconductor package having a bridge plate connection

2009-01-23

2011-11-08

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S692000, C257S735000

Reexamination Certificate

active

08053874

ABSTRACT:
A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.

REFERENCES:
patent: 7683464 (2010-03-01), Sun et al.

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