Semiconductor package for improving characteristics for...

Details Semiconductor package for improving characteristics for... Semiconductor package for improving characteristics for...

2008-12-31

2010-12-28

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S777000, C257S779000

Reexamination Certificate

active

07859115

ABSTRACT:
A semiconductor package includes a semiconductor chip having a first region and a second region. Bonding pads are formed and through-holes are defined in the first and second regions. Insulation layers are formed on sidewalls of the through-holes, and through-electrodes formed in the through-holes and connected with corresponding bonding pads. The insulation layers formed in the first and second regions have different thicknesses or dielectric constants.

REFERENCES:
patent: 6812549 (2004-11-01), Umetsu et al.
patent: 2004/0080040 (2004-04-01), Dotta et al.
patent: 2007/0048994 (2007-03-01), Tuttle
patent: 2007-335642 (2007-12-01), None
patent: 2009-004648 (2009-01-01), None
patent: 10-0830581 (2008-05-01), None
patent: 10-0879191 (2009-01-01), None

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