Semiconductor package for forming a double die package (DDP)

Details Semiconductor package for forming a double die package (DDP) Semiconductor package for forming a double die package (DDP)

2007-06-22

2009-02-10

Phan, Trong (Department: 2827)

Static information storage and retrieval

Hardware for storage elements

C365S189050, C365S194000, C365S230030, C365S230080, C365S236000

Reexamination Certificate

active

07489534

ABSTRACT:
A semiconductor package for forming a Double Die Package (DDP) with a plurality of single chips includes: a buffer configured to buffer an external address to generate a row address which is defined only in a DDP mode; a column address control unit configured to replace the row address with a column address, which is defined only in the DDP mode, in a single chip mode; and a read operation control unit configured to output a bank read signal latched in an active bank in a read mode of the DDP, and to selectively activate a first address control signal and a second address control signal for activating a bank selected from the single chip or the DDP in response to the bank read signal.

REFERENCES:
patent: 7227251 (2007-06-01), Sakuma et al.
patent: 7379380 (2008-05-01), Sohn et al.

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