Semiconductor package for encapsulating multiple dies and...

Details Semiconductor package for encapsulating multiple dies and... Semiconductor package for encapsulating multiple dies and...

2005-09-09

2008-10-21

Ha, Nathan W (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

07439098

ABSTRACT:
A semiconductor package comprises a silicon substrate having an insulative surface; a patterned metal layer, formed on the insulative surface of the silicon substrate; an insulation layer formed on the patterned metal layer, and the patterned metal layer being partially exposed for functioning as at least a set of the device attaching pads and ball attaching pads; at least a device electrically connected to the set of the device attaching pads; a sealing compound for covering portions of the insulative surface of the silicon substrate and encapsulating the devices; and a plurality of solder balls attached to the set of ball attaching pads.

REFERENCES:
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patent: 2006/0118928 (2006-06-01), Takita
patent: 2006/0263929 (2006-11-01), Matsunami

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