Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-11-08
1999-02-16
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361775, 361783, 361813, 438123, 438124, 257691, 257693, 174 524, H01L 2348
Patent
active
RE0360970
ABSTRACT:
A semiconductor package having outer leads which are not protruded from the package but only exposed to outside. The semiconductor package comprises a semiconductor chip which is formed with a plurality of bond pads at a central portion of its bottom surface, a lead frame including leads connected to bond pads for input/output of the bond pads respectively and bus bars connected to power supplying pads of the bond pads, insulation adhesives for attaching inner leads of the leads and inner leads of the bus bars to a bottom surface of the semiconductor chip formed with the bond pads, metal wires for electrically connecting the inner leads of the leads and the inner leads of the bus bars to the bond pads respectively, and a molding compound enveloping the semiconductor chip assembly with outer leads of the lead frame exposed to outside. The adhesive tapes are removed after a molding procedure.
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Goodenough, Frank: "Mixing Gold and Aluminum Bond Wires on Power Ics Cuts Cost and Ups Reliability"; 1990; p. 34; In: Electronic Design, 11, H..19.
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LG Semicon, Ltd.
Picard Leo P.
Vigushin John B.
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