Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Reexamination Certificate
2008-07-22
2008-07-22
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Reexamination Certificate
active
07402507
ABSTRACT:
A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.
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patent: 2005/0172894 (2005-08-01), Farnworth
Clarke Robert J.
McCartney Kenneth
Pavier Mark
Sawle Andrew
Standing Martin
Geyer Scott B.
International Rectifier Corporation
Ostrolenk Faber Gerb & Soffen, LLP
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