Metal working – Method of mechanical manufacture – Disassembling
Patent
1996-11-15
1998-12-01
Vo, Peter
Metal working
Method of mechanical manufacture
Disassembling
29260, 29261, 29266, 29741, 29758, 29764, B23P 1904, H05K 1300
Patent
active
058422617
ABSTRACT:
A semiconductor package extractor is provided that extracts a semiconductor package from a socket on a circuit board. The extractor has an outer base and an inner base which are attached via a bolt. Turning the bolt raises or lowers the inner base. The inner base has an inner frame with multiple levers that swing freely inward and outward attached to the inner frame. The levers swing outward to surround the semiconductor package as the inner base is lowered onto the inner base and underlying circuit board. The levers swing inward to securely grip the semiconductor package as the outer base is lowered onto the circuit board. As the bolt is turned, the inner base, gripping the semiconductor package, is raised, removing the semiconductor package from the circuit board.
REFERENCES:
patent: 3401445 (1968-09-01), Fritch
patent: 4180903 (1980-01-01), Hannigan, Jr.
patent: 4521959 (1985-06-01), Sprenkle
patent: 4583288 (1986-04-01), Young
patent: 4800647 (1989-01-01), Guyer
patent: 4984355 (1991-01-01), Lubrano et al.
patent: 5193269 (1993-03-01), Dattilo
patent: 5230143 (1993-07-01), Karlovich
patent: 5365653 (1994-11-01), Padrun
patent: 5502887 (1996-04-01), Gonzales
IBM Technical Disclosure Bulletin vol. 28, No. 9, Feb. 1986, pp. 3823-3824.
Advanced Micro Devices , Inc.
Vo Peter
Wisor Rita M.
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