Semiconductor package employing substrate assembly having a pair

Details Semiconductor package employing substrate assembly having a pair Semiconductor package employing substrate assembly having a pair

1991-11-29

1994-12-20

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361761, 361792, 361810, 174255, 257686, H05K 111

Patent

active

053750420

ABSTRACT:
A semiconductor package and an electronic circuit board in which the semiconductor package is mounted on an external circuit board. The semiconductor package has a substrate assembly and a semiconductor mounted on the substrate, where the substrate assembly is composed of a thick film circuit in the form of a ceramic circuit board and a pair of thin film circuits disposed one on each of opposite surfaces of the thick film circuits. Such a substrate assembly has one surface thereof connected to, i.e. electrically contacting, the semiconductor and an opposing surface thereof adapted to be connected to an external circuit. The thin film circuits of the assembly are formed of a heat-resisting resin and a conducting material.

REFERENCES:
patent: 4739448 (1988-04-01), Rowe et al.
patent: 4754371 (1988-06-01), Nitta et al.
patent: 4910643 (1990-03-01), Williams
patent: 4959900 (1990-10-01), de Givry et al.
patent: 5110664 (1992-05-01), Nakanishi et al.
Microelectronics Packaging Handbook, Van Nostrand Reinhold (1989), pp. 673-725, "Thin-Film Packaging".

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