Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-11-13
2010-12-07
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S688000, C257S730000, C257SE23078, C257SE23169, C257SE23194
Reexamination Certificate
active
07847389
ABSTRACT:
Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.
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Mikami Nobuhiro
Sato Junya
Sawada Atsumasa
Watanabe Shinji
Clark Jasmine J
NEC Corporation
Young & Thompson
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