Semiconductor package, electronic circuit device, and...

Details Semiconductor package, electronic circuit device, and... Semiconductor package, electronic circuit device, and...

2005-12-27

2005-12-27

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C361S770000

Reexamination Certificate

active

06979781

ABSTRACT:
A semiconductor package has first and second surfaces and has a plurality of pedestals disposed on the first surface, for keeping a certain height of the semiconductor package after mounting.

REFERENCES:
patent: 4833570 (1989-05-01), Teratani
patent: 5255159 (1993-10-01), Seyk
patent: 5489752 (1996-02-01), Cognetti et al.
patent: 5495395 (1996-02-01), Yoneda et al.
patent: 5528462 (1996-06-01), Pendse
patent: 5684677 (1997-11-01), Uchida et al.
patent: 5751556 (1998-05-01), Butler et al.
patent: 5886878 (1999-03-01), Khadem et al.
patent: 6156408 (2000-12-01), Zhou et al.
patent: 11-163186 (1999-06-01), None

Affiliated with

Also associated with

Rating

Semiconductor package, electronic circuit device, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package, electronic circuit device, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package, electronic circuit device, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3499074