Semiconductor package ejector

Details Semiconductor package ejector Semiconductor package ejector

1999-11-10

2002-12-03

Feild, Lynn D. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

06490167

ABSTRACT:

FIELD OF THE INVENTION
Embodiments of the present invention provide an apparatus and method for ejecting a semiconductor package. More particularly, embodiments of the present invention provide an apparatus and method for ejecting a semiconductor package from a socket.
BACKGROUND OF THE INVENTION
A known semiconductor package extractor is a screw handle extractor that pulls a semiconductor package from a socket.
FIG. 1
shows an illustration of a known screw handle extractor
100
for pulling a semiconductor package
150
(e.g., a pin grid array package) from a socket
120
. Screw handle extractor
100
includes a handle
101
affixed to a screw shaft
102
. Bracket
103
is also affixed to screw shaft
102
. Screw shaft
102
rotates through threaded passage
104
of housing
105
. Bracket
103
includes lip
106
and lip
107
, each of which can be positioned under an edge of semiconductor package
150
. Housing
105
can rest upon an upper surface of socket
120
, which includes a plurality of pin receptors
121
to receive pins
156
and mechanically and electrically couple package
150
to socket
120
.
Package
150
can include a cover
151
that may disperse heat from a semiconductor die
153
. A thermal interface material
152
(e.g., an elastomer type material, a grease and phase change material, etc.) mechanically and thermally couples cover
151
and semiconductor die
153
. A plurality of solder bump connections mechanically and electrically couple semiconductor die
153
and substrate
155
. The package
150
includes at least one wiring layer (not shown) to electrically couple semiconductor die
153
to pins
156
.
To extract package
150
from socket
120
, housing
105
can rest upon the upper surface of socket
120
and each of lips
106
,
107
may be positioned under an edge of package
150
. Handle
101
is then rotated to move bracket
103
away from socket
120
. As bracket
103
moves away from socket
120
, lips
106
and
107
pull package
150
out of socket
120
.
FIG. 2
is an illustration of the forces exerted upon a package during extraction of the package from a socket by the screw handle extractor illustrated in FIG.
1
. Lips
106
and
107
apply pulling forces
201
and
202
to the edges of package
150
in a direction away from socket
120
. Friction between the pins of package
150
and socket
120
exerts retention forces
205
about the central portion of package
150
and in the direction of socket
120
. When the pulling forces
201
and
202
exceed the retention forces
205
, the package
150
can be pulled out of the socket
120
.
Pulling package
150
from socket
120
with screw handle extractor
100
can disadvantageously result in degradation of the mechanical and thermal coupling of cover
151
and semiconductor die
153
.
FIG. 3
shows an illustration of degradation of the thermal coupling between a package cover and a semiconductor die. The pulling forces
201
and
202
applied along the edges of package
150
can result in cover
151
being deflected away from semiconductor die
153
and may degrade the thermal interface between the cover
151
and semiconductor die
153
. For example, thermal interface material
152
may delaminate from cover
151
and/or semiconductor die
153
. The pulling forces
201
and
202
can also cause substrate deflection under the semiconductor die
153
during package extraction.
Other known apparatus that can remove a pin grid array package from a socket include a raked-end crowbar. The raked-end crowbar can lever a pin grid array package away from the socket. The tines of the raked-end of the crowbar can be positioned between the pins of the pin grid array under an edge of the pin grid array package. The other end of the crowbar is then pushed down to lever the edge of the pin grid array package away from the socket. Use of a raked-end crowbar can also disadvantageously cause thermal interface degradation between cover
151
and semiconductor die
153
. Another known apparatus to facilitate removal of a semiconductor package from a socket is a zero insertion force (ZIF) socket. A ZIF socket typically requires longer stubs—the electrical path from the package pins to the board bus—which can disadvantageously degrade system performance.
In view of the foregoing, it can be appreciated that a substantial need exists for a method and system which can advantageously eject a semiconductor package from a socket.
SUMMARY OF THE INVENTION
Embodiments of the present invention provide apparatus and methods to eject a semiconductor package from a semiconductor package socket. A package ejector can be coupled to a semiconductor package socket. The package ejector can include an ejector cam and be coupled to an upper surface of the semiconductor package socket.


REFERENCES:
patent: 4190310 (1980-02-01), Bright et al.
patent: 4531795 (1985-07-01), Sinclair
patent: 4666199 (1987-05-01), Cheh
patent: 5380213 (1995-01-01), Piorunneck et al.
patent: 5707245 (1998-01-01), Yamamoto et al.
patent: 6022229 (2000-02-01), Nishimura et al.
patent: 6042401 (2000-03-01), Oguchi et al.
patent: 6185106 (2001-02-01), Mueller
patent: 6224404 (2001-05-01), Sauer

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