Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2006-03-07
2006-03-07
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257S666000
Reexamination Certificate
active
07009309
ABSTRACT:
A semiconductor package device includes an insulative housing, a semiconductor chip, and a lead, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side surface between the top and bottom surfaces, the bottom surface includes a peripheral portion and a central portion within the peripheral portion, the peripheral portion protrudes downwardly from the central portion, the chip includes a conductive pad, and the lead protrudes laterally from and extends through the peripheral side surface and is electrically connected to the pad.
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Bridge Semiconductor Corporation
Sigmond David M.
Zarneke David A.
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