Semiconductor package containing multi-layered semiconductor...

Details Semiconductor package containing multi-layered semiconductor... Semiconductor package containing multi-layered semiconductor...

2006-11-27

2008-12-02

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23011, C257SE25013, C257SE23178, C257S777000, C257S723000, C257S690000, C257S774000, C257S773000, C257S778000

Reexamination Certificate

active

07459777

ABSTRACT:
According to this invention, a semiconductor package includes: a plurality of semiconductor chips, each having through electrodes; and a semiconductor interposer, on which the plurality of semiconductor chips are mounted. Each of the semiconductor chips includes: a semiconductor substrate; a wiring layer formed on the semiconductor substrate; an opaque resin layer sealing the wiring layer and a side surface of the semiconductor chip; and conductive bumps to be connected to the through electrodes.

REFERENCES:
patent: 5907178 (1999-05-01), Baker et al.
patent: 6355501 (2002-03-01), Fung et al.
patent: 7259454 (2007-08-01), Tanida et al.
patent: 2005/0212126 (2005-09-01), Sunohara
patent: 2005/0276299 (2005-12-01), Kondo
patent: 2006/0267206 (2006-11-01), Tanida et al.
patent: 2005-044861 (2005-02-01), None

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