Semiconductor package capable of performing various tests...

Data processing: measuring – calibrating – or testing – Testing system – Of circuit

Reexamination Certificate

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Reexamination Certificate

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07831405

ABSTRACT:
A semiconductor package includes an input pin that receives a first signal from the outside of the semiconductor package, a pad that is coupled to the input pin, and a test mode driving circuit that receives the first signal from the pad and outputs a plurality of test mode signals to drive a test apparatus in a semiconductor chip.

REFERENCES:
patent: 5263031 (1993-11-01), Inoue
patent: 5687180 (1997-11-01), Kawasaki
patent: 5901105 (1999-05-01), Ong et al.
patent: 6462996 (2002-10-01), Ooishi
patent: 6940765 (2005-09-01), Kyung
patent: 02-188836 (1990-07-01), None
patent: 9106698 (1997-04-01), None
patent: 2000-304831 (2000-11-01), None
patent: 2005071582 (2005-03-01), None
patent: 1019950013606 (1995-11-01), None

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