Semiconductor package and socket thereof and methods of fabricat

Details Semiconductor package and socket thereof and methods of fabricat Semiconductor package and socket thereof and methods of fabricat

1997-08-28

1999-11-02

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257704, 257690, 257698, 257703, H01L 2348, H01L 2352, H01L 2306

Patent

active

059776234

ABSTRACT:
A semiconductor package and a socket thereof that are easily adaptable to a multiple pin structure includes a nonconductive base layer, a plurality of conductive metallic leads that extend vertically through the base layer, a wiring layer in which a pattern of fine metallic wires are formed to electrically couple to the conductive metallic leads to a semiconductor chip mounted in the package, a recess formed in the central portion of the wiring layer, and a cover for closing the upper portion of the recess. A semiconductor chip is mounted on the bottom portion of the recess, and conductive wires electrically couple the semiconductor chip to the fine metallic wires of the wiring layer. A socket for receiving the semiconductor package includes a socket body, a first plurality of socket pins arranged to couple with leads on a bottom surface of a semiconductor chip package mounted in the socket, a second plurality of socket pins arranged to couple with leads on peripheral side surfaces of a semiconductor chip package mounted in the socket, and a hinged cover.

REFERENCES:
patent: 5043794 (1991-08-01), Tai et al.

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