Semiconductor package, and semiconductor device using the same

Details Semiconductor package, and semiconductor device using the same Semiconductor package, and semiconductor device using the same

1996-04-29

1998-12-01

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257675, 257676, 257684, 257692, 361813, H05K 720

Patent

active

058447792

ABSTRACT:
A semiconductor package is provided. A semiconductor chip including bonding pads has a plurality of leads disposed on and attached to the upper surface of the semiconductor chip. The leads include bonding tips that are electrically connected to the bonding pads by bonding wires. A molding compound encapsulates the chip and portions of the leads. Upper portions of the leads extend from the molding compound. The exposed upper portions of the leads may be connected to a circuit board. Heat dissipation from the semiconductor chip is facilitated with the disclosed package.

REFERENCES:
patent: 4080512 (1978-03-01), Ramet et al.
patent: 4677526 (1987-06-01), Muehling
patent: 4873615 (1989-10-01), Grabbe
patent: 4907129 (1990-03-01), Shimizu
patent: 5299091 (1994-03-01), Hoshi et al.
patent: 5559366 (1996-09-01), Fosal et al.
patent: 5654877 (1997-08-01), Burns

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