Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2004-06-09
2008-10-14
Pizarro, Marcos D. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257SE23101
Reexamination Certificate
active
07436060
ABSTRACT:
A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the substrate. The die is electrically connected with electrical connections formed on the substrate using bonding wires. A preformed one-piece integrated mold cap and heatspreader assembly attached to the substrate to enclose at least a portion of the bonding wires and the die. Methods of assembling semiconductor integrated circuit packages using a preformed one-piece integrated mold cap and heatspreader assembly are also disclosed.
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Legaspi, Jr. Severino A.
Othieno Maurice O.
Patel Pradip
Thavarajah Manickam
Beyer Law Group LLP
LSI Corporation
Pizarro Marcos D.
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