Semiconductor package and packaging method using flip-chip...

Details Semiconductor package and packaging method using flip-chip... Semiconductor package and packaging method using flip-chip...

2006-08-29

2006-08-29

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S774000, C438S106000

Reexamination Certificate

active

07098535

ABSTRACT:
A semiconductor package and packaging method using a flip-chip bonding technology is disclosed. In the semiconductor package and packaging method, the microelement array of a micro-device, for example, the micromirror array of a light modulator having micromirrors that are hyperfine elements, is sealed from the outside using flip-chip bonding technology. Thus, the microelement array is protected from the outside. The packaging method executes the packaging process using only the flip-chip bonding technology, without a wire-bonding technology, at a wafer level instead of a conventional individual semiconductor device level, thus increasing the bonding process efficiency. Furthermore, the electrode array pattern for supplying both electricity and control signals to the microelement array does not pass through a hermetic sealing layer, thus ensuring a well-sealed semiconductor package. The electrode array pattern is also finely formed to correspond to the microelement array which is extremely finely formed.

REFERENCES:
patent: 5293511 (1994-03-01), Poradish et al.
patent: 5856914 (1999-01-01), O'Boyle
patent: 6303986 (2001-10-01), Shook
patent: 6455927 (2002-09-01), Glenn et al.
patent: 6929974 (2005-08-01), Ding et al.

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