Semiconductor package and mounting socket thereof

Details Semiconductor package and mounting socket thereof Semiconductor package and mounting socket thereof

1997-12-19

2000-07-25

Cuchlinski, Jr., William A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 523, 174 524, 361260, 361761, 361764, 257723, 257784, 257684, 257700, H01L 2328

Patent

active

060938897

ABSTRACT:
A mounting socket for a semiconductor package has socket leads that contact the semiconductor package's external leads. The semiconductor package has a package body surrounding a semiconductor chip, as well as internal and external leads. The external leads are formed in an ingot shape and project outwardly from the package body, and are adapted to connect with the socket leads or external terminals. The external leads contact external walls of the package body, thereby preventing undesired bending or breaking of the leads when the package is handled. Fixing and reworking of the package in the socket is easy, since the semiconductor package is inserted into grooves in the socket. It is possible to stack-mount or side-by-side-mount the package, depending on the socket shape, thus improving socket density and making the arrangement suitable for miniaturization.

REFERENCES:
patent: 5669783 (1997-09-01), Inoue et al.
patent: 5731633 (1998-03-01), Clayton
patent: 5763943 (1998-07-01), Baker et al.
patent: 5818107 (1998-10-01), Pierson et al.

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