Semiconductor package and method with vertically extended electr

Details Semiconductor package and method with vertically extended electr Semiconductor package and method with vertically extended electr

1995-06-07

1996-05-14

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257693, 257723, H01L 2334

Patent

active

055170587

ABSTRACT:
A package for one or more semiconductor devices has an electrically insulative and thermally conductive base on a thermally conductive support. The semiconductor devices may be enclosed in an encapsulant and are electrically contacted through leads that extend through the encapsulant.

REFERENCES:
patent: 3864727 (1975-02-01), Schoberl
patent: 4819042 (1989-04-01), Kaufman

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