Semiconductor package and method thereof

Details Semiconductor package and method thereof Semiconductor package and method thereof

1996-09-04

1998-07-07

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438460, H01L 2144

Patent

active

057767980

ABSTRACT:
A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).

REFERENCES:
patent: 4961821 (1990-10-01), Drake et al.
patent: 5061657 (1991-10-01), Queen et al.
patent: 5188984 (1993-02-01), Nishiguchi
patent: 5462636 (1995-10-01), Chen et al.
patent: 5491111 (1996-02-01), Tai
patent: 5604160 (1997-02-01), Warfield
patent: 5641714 (1997-06-01), Yamanaka
Arnold et al., "Stressed-out-Microelectronic Encapsulation Finds Cure in Aerobic Adhesives", Advanced Packaging, Jan./Feb. 1996, pp. 30,32,34.

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