Semiconductor device manufacturing: process – Making regenerative-type switching device – Having field effect structure
Reexamination Certificate
2011-04-19
2011-04-19
Ngo, Hung V (Department: 2831)
Semiconductor device manufacturing: process
Making regenerative-type switching device
Having field effect structure
C438S460000
Reexamination Certificate
active
07927927
ABSTRACT:
A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and21) that are substantially identical. The entire array of package sites (13, 14, 16, and21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and21) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (11).
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Coffman Samuel L.
Hagen Deborah A.
Nelson Keith E.
Quan Son Ky
Reid Bruce
Freescale Semiconductor Inc.
Ngo Hung V
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