Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2006-05-09
2006-05-09
Kang, Donghee (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S668000, C257S684000, C257S701000, C438S107000, C438S108000
Reexamination Certificate
active
07042072
ABSTRACT:
A semiconductor package and method of producing the same has a semiconductor die having a first face and a second face. A coating material is coupled to the second face of the semiconductor die. A substrate having a cavity is provided wherein the semiconductor die is placed within the cavity. An encapsulant is used to encapsulate the second face of the semiconductor die placed in the cavity. Connection members are provided to couple the semiconductor die and the substrate in order to transfer signals between the semiconductor die and the substrate. Terminal members are couple to the substrate to connect the semiconductor package to an external device. In the semiconductor package, a thermal expansion coefficient of the coating material C and a thermal expansion coefficient of the encapsulant E should be approximately equal in value in order to limit the problems associated with warpage.
REFERENCES:
patent: 4722130 (1988-02-01), Kimura et al.
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5798014 (1998-08-01), Weber
patent: 5835355 (1998-11-01), Dordi
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5952611 (1999-09-01), Eng et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6034427 (2000-03-01), Lan et al.
patent: 6060778 (2000-05-01), Jeong et al.
patent: 6072243 (2000-06-01), Nakanishi
patent: 6100804 (2000-08-01), Brady et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6127833 (2000-10-01), Wu et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6184463 (2001-02-01), Panchou et al.
patent: 6214641 (2001-04-01), Akram
patent: 6225703 (2001-05-01), Umehara et al.
patent: 6235554 (2001-05-01), Akram et al.
patent: 6294831 (2001-09-01), Shishido et al.
patent: 6361959 (2002-03-01), Beroz et al.
patent: 6395578 (2002-05-01), Shin et al.
patent: 6555924 (2003-04-01), Chai et al.
patent: 6558975 (2003-05-01), Sugino et al.
patent: 6656819 (2003-12-01), Sugino et al.
patent: 6790710 (2004-09-01), McLellan et al.
patent: 2002/0180024 (2002-12-01), Huang et al.
patent: 2003/0218237 (2003-11-01), Hall et al.
patent: 05136323 (1993-01-01), None
patent: 05109975 (1993-03-01), None
patent: 10-173085 (1998-06-01), None
Choi Seok Hyun
Kim Young Ho
Lee Choon Heung
Park Sung Soon
Park Sung Su
Amkor Technology Inc.
Kang Donghee
Weiss, Moy & Harris P.C.
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