Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
1999-01-26
2001-11-06
Bowers, Charles (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257S659000, C257S660000
Reexamination Certificate
active
06312975
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is based upon and claims priority from prior French Patent Application No. 98-01549, filed Feb. 10, 1998, the entire disclosure of which is herein incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to semiconductor packages, and more specifically to a semiconductor package that provides optimum electrical characteristics.
2. Description of Related Art
Currently, a user requiring a high-performance semiconductor package must choose a package in which an integrated circuit chip and an external lead frame are assembled inside a ceramic case. While using a ceramic case allows optimum electrical characteristics to be obtained, the cost of ceramic case packages is higher than the cost of semiconductor packages in which the integrated circuit chip is encapsulated in an epoxy resin.
SUMMARY OF THE INVENTION
In view of these drawbacks, it is an object of the present invention to remove the above-mentioned drawbacks and to provide a low cost semiconductor package that provides characteristics similar to the characteristics of ceramic case-type semiconductor packages. The semiconductor package has an encapsulation that encapsulates an integrated circuit chip and an external lead frame for the chip. Multiple connection leads project from the periphery of the encapsulation. At least one external face of the encapsulation is covered with a layer of electrically conductive material, and the conducting material layer has at least one lateral extension that electrically contacts at least one of the projecting connection leads.
Another object of the present invention is to provide a method of manufacturing a low cost semiconductor package that provides characteristics similar to the characteristics of ceramic case-type semiconductor packages. A layer of electrically conductive material is deposited on at least one face of the encapsulation, and the conducting material layer has at least one lateral extension that electrically contacts at least one projecting connection lead. According to one preferred method, the package is placed in an opening of a mask in such a position that the opening matches the outline of the encapsulation. The wall of the opening has at least one recess that forms a well that emerges opposite at least one of the connection leads. The layer of electrically conductive material is deposited (e.g., by spraying or screen printing) in or through the opening. In further embodiments, an electrically conductive metal sheet is adhesively bonded to at least one face of the encapsulation. Preferably, the manufacturing method can be integrated into already existing assembly lines.
Other objects, features, and advantages of the present invention will become apparent from the following detailed description. It should be understood, however, that the detailed description and specific examples, while indicating preferred embodiments of the present invention, are given by way of illustration only and various modifications may naturally be performed without deviating from the present invention.
REFERENCES:
patent: 5270488 (1993-12-01), Ono et al.
patent: 5679975 (1997-10-01), Wyland et al.
patent: 58-122759 (1983-07-01), None
patent: 59-022333 (1984-02-01), None
patent: 59-051555 (1984-03-01), None
patent: 3-053550 (1991-03-01), None
patent: 4-147652 (1992-05-01), None
patent: 4-278567 (1992-10-01), None
Brechignac Rémi
Castellane Alexandre
Berezny Nema
Bongini Stephen C.
Bowers Charles
Fleit Kain Gibbons Gutman & Bongini P.L.
Galanthay Theodore E.
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