Semiconductor package and method of manufacturing the same

Details Semiconductor package and method of manufacturing the same Semiconductor package and method of manufacturing the same

1997-08-18

1999-03-30

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257698, 257693, 257678, H01L 2312, H01L 2304, H01L 2302

Patent

active

058893237

ABSTRACT:
A cap that functions as a heat sink is affixed to the obverse surface of a semiconductor chip having ball bumps attached to the wiring pads on its surface, following which the semiconductor chip with the affixed cap is mounted on the bottom surface of a depression in a case and the opening of the depression in the case is simultaneously sealed by the cap.

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