Semiconductor package and method of manufacture thereof

Details Semiconductor package and method of manufacture thereof Semiconductor package and method of manufacture thereof

1975-10-08

1977-03-15

Wojciechowicz, Edward J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 174 52FP, 29588, 29591, H01L 2348, H01L 2328, H02G 1308, B01J 1700

Patent

active

040127664

ABSTRACT:
An improved plastic package and method of manufacture thereof for use in packaging integrated circuit semiconductor devices and the like. A transfer molded package having the lead frame disposed therein is formed having an opening therethrough. The device to be packaged is mounted on a stepped mounting member which then is located with respect to the opening with the height of the step being selected to generally dispose the top surface of the device substantially co-planar with the adjacent leads of the package. Sealing of the package may be accomplished by potting the upper and lower cavities of the opening in the plastic package, or by potting or cementing over a cup above the device so the space immediately above the device remains unfilled after sealing.

REFERENCES:
patent: 3509430 (1970-04-01), Mroz
patent: 3689683 (1972-09-01), Paletto

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