Semiconductor package and method of fabricating the same

Details Semiconductor package and method of fabricating the same Semiconductor package and method of fabricating the same

2005-05-03

2005-05-03

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S099000, C257S687000

Reexamination Certificate

active

06888209

ABSTRACT:
A semiconductor package includes a semiconductor substrate having a device region on one surface thereof, and a connecting pad electrically connected to the device region. A support substrate is formed on a side of one surface of the semiconductor substrate. An external electrode formed on a side of the other surface of the semiconductor substrate. A connecting wire is partially extended outside the semiconductor substrate for electrically connecting the connecting pad and external electrode.

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