Semiconductor package and method of fabricating same

Details Semiconductor package and method of fabricating same Semiconductor package and method of fabricating same

2006-06-27

2006-06-27

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S666000, C257S668000, C257S669000, C257S670000

Reexamination Certificate

active

07067357

ABSTRACT:
A semiconductor package includes a semiconductor chip provided with a plurality of electric terminals and a plurality of electrically conductive members electrically connected with the electric terminals. Connection terminals that are spherical in shape and made of solder are electrically connected with the electrically conductive members. A sealing member is used for sealing the semiconductor chip and the electrically conductive members, and for covering the connection terminals so as to allow a part thereof to be exposed. The electrically conductive members are provided with bonding promoters and are connected with the respective spherical connection terminals at the respective bonding promoters.

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