Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – With specified electrode means
Reexamination Certificate
2006-02-21
2006-02-21
Graybill, David E. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Bipolar transistor structure
With specified electrode means
C257S693000, C257S698000, C257S702000, C257S704000, C257S710000, C438S118000, C438S122000, C438S124000, C438S126000, C438S612000
Reexamination Certificate
active
07002236
ABSTRACT:
A semiconductor package in which solder balls can be loaded on an encapsulated resin to reduce the package area and a method for producing the semiconductor package. An apparatus for carrying out the method includes a first insulating substrate5carrying a mounting portion3for mounting a semiconductor device2and a first electrically conductive pattern4electrically connected to the semiconductor device2, a sidewall section6formed upright around the mounting portion of the first insulating substrate, a cavity7defined by the first insulating substrate5and the sidewall section and encapsulated by an encapsulating resin12as the semiconductor device2is mounted on the mounting portion3and a second insulating substrate10provided in the cavity7and on the sidewall section6and carrying a second electrically conductive pattern31electrically connected to the first electrically conductive pattern4via plated through-holes26formed in the sidewall section6. A solder land9is provided in a lattice on one entire surface of the second insulating substrate10.
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“Land,” Printed Wiring Technologies Limited, http://www.pwtpcbs.com/glossary/land.html 4-3-3.
Graybill David E.
Kananen Ronald P.
Rader & Fishman & Grauer, PLLC
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