Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2009-07-10
2011-11-08
Dang, Trung Q (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S784000, C257SE23021, C257SE23025
Reexamination Certificate
active
08053906
ABSTRACT:
A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
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Chang Hsiao Chuan
Chen Jian Cheng
Hsu Cheng Tsung
Hung Chang Ying
Hung Chih Cheng
Advanced Semiconductor Engineering Inc.
Dang Trung Q
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